The IP-330 Series Process Cleaners offer innovative aqueous design features for cleaning semiconductor wafer handling materials. In typical application, i.e., cleaning FOUPs/FOSBs or smaller form factor parts from 50mm to 300mm, submicron particles are wash from the parts. The stainless steel frame is covered in corrosion-resistant plastic material (either polypropylene or optional PVDF) for the highest cleanliness level suitable for clean room operations. These cleaners are rigid built to last, and yet pleasant to the eyes.

• Fully-automatic PLC controlled (optional PC control)
• Clean all wafer handling materials and substrate handling parts
• State-of-the-art design innovations
• High-grade ULPA or HEPA filtration for heated blower and CDA/N2 Drying
• Versatility to clean practically all types of wafer handling materials
• Touch screen Graphical User Interface for ease-of-use operation
• High throughput and short cycle time
• Small footprint in the clean room
• Lowest cost-of-ownership
• No consumable parts
• On-board DIW reservoirs supply heated DIW for wash and rinse
• Support clean room ranging from Class 1,000 to Class 1