The IPS-330 Series Process Cleaners offer innovative aqueous design features for cleaning semiconductor wafer handling materials. In typical application, i.e., cleaning FOUPs/FOSBs, the parts are washed to remove submicron particles, rinsed and dried. The stainless steel frame is covered with Alucobond panels, stainless steel or other types of corrosion-resistant plastic material, i.e., polypropylene. The ultrasonic wash tank, spray rinse, dry chamber(s) and components come in polypropylene or other FM4910 compliant materials such as PVDF. These cleaners meet all applicable semiconductor codes and built to last.

• Fully-automatic PLC controlled (optional PC control)
• Designed for cleaning FOUPs/FOSBs, but can also configured to clean smaller form factor wafer handling materials
• State-of-the-art design innovations including heated vacuum dry
• High-grade 0.05um filtration for heated CDA drying
• Touch screen Graphical User Interface for ease-of-use operation
• High throughput and short cycle time
• Smallest footprint for its class of aqueous cleaners
• Lowest cost-of-ownership
• No consumable parts other than filters
• Support clean room ranging from Class 1,000 to Class 1